Custom Packaging


From engineering design, packaging, to finished product, our advanced simulation and modeling tools enable us to provide you with innovative product to meet your power solution requirements. Sensitron's Advanced Baseless Packaging Technology is a cost effective packaging solution that generates maximum weight savings with high thermal conductivity and fatigue resistance.
Product Features:
  • Lower profile and light weight
  • Lowest possible thermal resistance
  • Excellent thermal fatigue resistance
  • Higher temperature applications
  • Lower cost
  • Automation friendly
  • Hermetic or plastic

Module Design Considerations:

•Optimum baseplate options
•Design for excellent thermal fatigue resistance
•Higher temperature design
•Light weight designs
•Space grade hermetic packages
•Extended temp range plastic module packages
•Full military temp range, shock, vibration & environmental factors
•High current, low inductance packages

Module Packaging Comparison

Power Packaging & Cooling
SMD-0.2,0.5 High Strength Packages:

  • Patented rugged package design
  • Enhanced temperature/power cycling capability over standard SMD-0.2 package
  • Package and PCB Temperature cycling verification complete. White paper available.
  • Options to ground different nodes to lid (per datasheet)
  • Samples available